Polishing and Abrasive Compounds
Electron Microscopy Sciences Glennel Diamond Paste UC Oil Soluble, Monocrystalline 3 µm 5 GR
Glennel diamond products are specially formulated to help you prepare surfaces that are usually difficult to polish and require precision finish. To satisfy today's demand the diamond compounds must be complex with near perfect tolerances as is ours. UC formulation is for fast cutting action and superior finish on wire dies, molds, cold heading dies, and more. Use with Formula C extender. Monocrystalline diamonds provide a cost effective means for good stock removal and finish.
Type: Monocrystalline
Size: 3 µm
Electron Microscopy Sciences Silicone Carbide Dressing Stick
Made from silicon carbide. Use for cutting blade dressing.
Electron Microscopy Sciences Glennel Polycrystalline Diamond Spray, 3 µm particles 5 OZ
Glennel Diamond Aerosol Spray provides unsurpassed cutting action and finish. The inverted nozzle provides safe and easy access for difficult to reach areas while ensuring that every diamond particle is used. Special formulations allow the carrier to evaporate quickly, leaving a very uniform dispersion of diamond. This is especially useful when an operation requires a dry polishing cloth.
Particles: 3 µm
Electron Microscopy Sciences Diamond Polishing Powder, 3 µm particles 2 GR
Our diamond powder is made from synthetic diamonds.Our diamond powder is made from synthetic diamonds.
Size: 3 µm
Electron Microscopy Sciences Diamond Polishing Powder, 6 µm particles 2 GR
Our diamond powder is made from synthetic diamonds.Our diamond powder is made from synthetic diamonds.
Size: 6 µm
Electron Microscopy Sciences Diamond Polishing Powder, 15 µm particles 2 GR
Our diamond powder is made from synthetic diamonds.Our diamond powder is made from synthetic diamonds.
Size: 15 µm
Electron Microscopy Sciences Lapping & Polishing Fixture Cutting Weight 40g
Weight for use with lapping and polishing fixtures.
Electron Microscopy Sciences Lapping & Polishing Fixture Cutting Weight 600g
Weight for use with lapping and polishing fixtures.
Electron Microscopy Sciences Silicone Carbide Powder, 18 µm particles 1 LB
Dark gray 98% SiC. Hardness, Moh's scale 9.0; Knoop Scale 2500. Crystallography: hexagonal–alpha and beta phase.
Size: 18 µm
Electron Microscopy Sciences Silicone Carbide Abrasive Film Disc, 3 µm, Plain Back
Silicon carbide abrasive film discs are ready to use for polishing and grinding. Discs are 8" in diameter.
Particles: 3 µm
Backing: Plain
Electron Microscopy Sciences Silicone Carbide Abrasive Film Disc, 60 µm, PSA backing
Silicon carbide abrasive film discs are ready to use for polishing and grinding. Discs are 8" in diameter.
Particles: 60 µm
Backing: PSA
Electron Microscopy Sciences Silicone Carbide Powder, 23 µm particles 1 LB
Dark gray 98% SiC. Hardness, Moh's scale 9.0; Knoop Scale 2500. Crystallography: hexagonal–alpha and beta phase.
Size: 23 µm
Electron Microscopy Sciences Silicone Carbide Powder, 35 µm particles 1 LB
Dark gray 98% SiC. Hardness, Moh's scale 9.0; Knoop Scale 2500. Crystallography: hexagonal–alpha and beta phase.
Size: 35 µm
Electron Microscopy Sciences Silicone Carbide Abrasive Film Disc, 5 µm, PSA backing
Silicon carbide abrasive film discs are ready to use for polishing and grinding. Discs are 8" in diameter.
Particles: 5 µm
Backing: PSA
Electron Microscopy Sciences Silicone Carbide Abrasive Film Disc, 9 µm, PSA backing
Silicon carbide abrasive film discs are ready to use for polishing and grinding. Discs are 8" in diameter.
Particles: 9 µm
Backing: PSA